Semiconductor Engineering

Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding

A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...
Dataquest

CEA-Leti presents die-to-wafer hybrid bonding at 1 μm pitch, removing bottleneck for AI hardware

CEA-Leti has announced a major milestone in the evolution of 3D integration for high-performance computing (HPC), advanced smart-vision systems and artificial intelligence (AI), demonstrating a ...
AZoNano

The Manufacturing Challenges Behind Hybrid Bonding Adoption

Alignment accuracy, surface preparation, and process control are key factors in bringing hybrid bonding into semiconductor ...
Business Wire

Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...
New Electronics

Imec and EV Group showcase advances in wafer-to-wafer hybrid bonding

Imec and semiconductor equipment supplier EV Group (EVG) have demonstrated a wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch, marking a step ...
Semiconductor Engineering

Correlation & Commonality Analysis In Complex Semiconductor Ecosystems

The semiconductor industry is entering an era defined by heterogeneous integration and complex packaging technologies. Innovations such as wafer-on-wafer bonding, chiplets, multi-stacked die (2.5D/3D) ...