ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...
Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...
As semiconductor technology pushes the limits, "how to cut" has emerged as a key topic in semiconductor packaging, as important as "how to make." Even a circuit diagram drawn precisely with a ...
TORONTO, Aug. 12, 2025 /CNW/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing advanced wafer ...
TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...
Developing a highly automated wafer scriber that requires minimal service and engineering support. The initial Micro Processing Technology, Inc. (MPT) mission was to develop advanced computer control ...
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