Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Necessity is the mother of invention.

As China's memory-chip giants YMTC and CXMT progress towards IPOs, they shine a spotlight on Beijing's tech self-sufficiency ...

Samsung has reportedly created the world’s first 900-layer V-NAND flash storage chip prototype. In the era of AI growth and the massive demand for DRAM and NAND flash memory, Samsung is once again ...

NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...

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Japan’s Kioxia has set the mass production of its next-generation NAND flash memory as a top priority for next year — a move ...

TL;DR: Huawei has developed a 122TB SSD using its Die-on-Board chip-packaging technology, enhancing capacity density despite lacking access to advanced 3D NAND. This wafer-level packaging improves ...

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and ...

YMTC, which primarily engages in 3D NAND flash memory chips and solutions, launched its IPO process, with CITIC Securities ...

Something to look forward to: The memory industry is known for its conservative approach, often favoring incremental improvements over revolutionary changes. But as we look toward the end of the ...

SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...