For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
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First India-made chip module sent to US firm AOS
India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...
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