AI system coordinates chip, 3D IC & PCB design workflows, connecting engineering tools to automate planning, verification & ...

HSINCHU, Taiwan, April 21, 2026 /PRNewswire/ -- yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

A new technical paper titled “Generative AI for Analog Integrated Circuit Design: Methodologies and Applications” was published by researchers at McMaster University. “Electronic Design Automation ...

Traditional verification methods are proving inadequate for addressing critical reliability challenges in today’s increasingly complex integrated circuit (IC) designs. Modern IC design requires a ...

The AI-powered Copilot hardware design tool provides a chatbot-like assistant with a wealth of knowledge at your fingertips. What is Copilot and how does it use AI? The capabilities of Copilot.

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens' complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off, ...

Cadence photonics solution optimized for GF Fotonix platform, ushering in a new era of silicon photonics products Comprehensive Cadence photonics solution enables customers to streamline monolithic ...

Flexium Interconnect, a company specializing in flexible PCBs, has disclosed its intention to acquire the outstanding shares of IC design house Rafael Microelectronics for NT$170 (US$5.35) per share.

Siemens announced the Fuse EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed ...